Regulatory

Part:BBa_J45504:Design

Designed by: Stephen Payne   Group: iGEM06_MIT   (2006-06-21)


htpG Heat Shock Promoter


Assembly Compatibility:
  • 10
    COMPATIBLE WITH RFC[10]
  • 12
    COMPATIBLE WITH RFC[12]
  • 21
    COMPATIBLE WITH RFC[21]
  • 23
    COMPATIBLE WITH RFC[23]
  • 25
    COMPATIBLE WITH RFC[25]
  • 1000
    COMPATIBLE WITH RFC[1000]


Design Notes

None.


Source

Chris Voigt Lab at UCSF

References